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[Seminar] Causes and Countermeasures of Soldering Flux and Assembly Defects

We will systematically explain the perspective for identifying the root cause of implementation defects from the roles of flux and material composition!

In this seminar, we will explain soldering flux for preventing implementation defects and troubles, as well as the causes and countermeasures for implementation failures. I feel that many explanations about flux are difficult to understand. In this seminar, we will extract points where flux impacts defect countermeasures and reliability, presenting the information in an easy-to-understand manner. Finally, we will discuss the potential for significantly shortening reliability testing by utilizing the non-destructive testing methods for voids and cracks developed by our company. 【Seminar Overview (Partial)】 ■ Date: March 23, 2026 (Monday) 10:00 AM - 5:00 PM ■ Venue: Online only (Zoom system) ■ Participation Fee (including tax): 49,500 yen per person (including tax) ■ Course Materials: PDF materials (included in the participation fee) *For more details, please download the PDF or feel free to contact us.